‘The socket becomes the motherboard’ – how a Samsung-backed startup aims to change computing forever by integrating everything into an elegant package to tackle the AI ​​beast once and for all

Many system designers are exploring chiplet-based SiPs that go beyond the limitations and costs of massive single-die implementations, but rely heavily on silicon interposers as substrates for mounting and interconnecting the dies.

Silicon interposers deliver a higher data rate than organic substrates, but are not without disadvantages. They are expensive, proprietary and limit the number of chiplets that can be placed on a single substrate due to size limitations, while increasing TCO.