Samsung confirms next-generation HBM4 memory is in fact Snowbolt – and reveals it plans to flood the market with precious AI memory amid growing competition with SK Hynix and Micron

Samsung has revealed that it expects to triple its production of HBM chips this year.

“Following the third-generation HBM2E and fourth-generation HBM3, which are already in mass production, we plan to mass-produce the 12-layer fifth-generation HBM and 32 gigabit-based 128 GB DDR5 products in the first half of the year. years,” said SangJoon Hwang, EVP and head of the DRAM Product and Technology Team at Samsung, speaking at Memcon 2024.