Future exascale supercomputers will be built using these HPE Lego-like cases that could house nearly 100,000 AMD EPYC cores


  • HPE’s Cray EX4000 supports modular designs, scalable to 98,304 cores
  • Slingshot 400 interconnect doubles throughput, essential for exascale systems
  • Thanks to the collaboration between AMD and Nvidia, the computing density can exceed 10 petaflops

Future exascale supercomputers will adopt modular designs that enable improved scalability and efficiency, new reports claim.

The NextPlatform says Hewlett Packard Enterprise (HPE) is leading this transformation, with its Cray EX4000 systems, which leverage HPE’s Slingshot interconnect and innovative chassis to support up to 98,304 AMD Epyc cores per rack.