Top Samsung competitor unveils 16-layer HBM3e chips with world’s largest capacity – SK hynix promises improved performance for everyone


  • The 16-layer HBM3e chips are expected to be rolled out in 2025
  • New chips offer improved AI learning and inference capabilities
  • Users can expect lower latency, Sk hynix claims

SK hynix has announced plans to add four additional layers to its 12-HI HBM3e memory chips to increase capacity.

The move will see the company increase capacity from 36GB to 48GB, and the semiconductor giant expects to begin distributing sample products in early 2025.